Reported 8 months ago
The semiconductor industry is currently focusing on the development of advanced packaging, with research firm TechInsights estimating a 6% year-on-year increase in sales of wafer fab equipment for advanced packaging to reach $3.1 billion in 2024. Advanced packaging, driven by strong demand for AI chips, is continuously growing, and companies are ramping up their investments. Last year, the global packaging market was worth $94 billion, with advanced packaging accounting for 50%. In terms of specific advanced packaging wafer fab equipment, TechInsights predicts that sales of inspection equipment are likely to lead with a 7% growth rate, followed by wafer bonding, lithography, deposition, etching, and cleaning equipment, all expected to grow by 6% annually. Chemical mechanical planarization equipment's growth rate for this year is slightly lower at 5%. Meanwhile, the global semiconductor industry is experiencing robust growth, with the Semiconductor Industry Association (SIA) reporting a 15.8% year-on-year increase in global semiconductor sales to $46.4 billion in April 2024, showing a steady monthly growth as well. SIA forecasts that global semiconductor sales will reach a record high of $611.2 billion this year, with a potential increase to $687.4 billion next year. Furthermore, the World Semiconductor Trade Statistics (WSTS) organization predicts a 16% year-on-year growth in global semiconductor sales this year and a 12.5% increase next year, indicating strong growth in the industry.
Source: YAHOO