Reported 9 months ago
ASE Technology Holding, a leading global semiconductor testing and packaging company, projects its advanced packaging business, particularly in AI applications, to exceed the set target of $250 million, driven by strong demand. The company plans to expand testing capacity in subsidiary ISE Labs, Inc., considering increasing production in Japan, the US, and Mexico to capitalize on AI opportunities. With a focus on advanced packaging technologies, ASE aims to maintain competitiveness and contribute to Taiwan's AI ecosystem. Market research indicates a significant growth potential in the advanced packaging sector, particularly in 2.5D/3D packaging, with ASE strengthening overseas production capacity to meet market demands. Collaborations with major chip companies like TSMC also play a key role in meeting customer needs and market trends.
Source: YAHOO