Reported 12 months ago
TSMC's SoIC platform gains heavyweight customer Apple for their next-generation M series chips, providing a boost for board partner Xinxiang as they secure a major order together. Xinxiang already supplies boards for Apple's current M series, and with TSMC's advanced packaging advancements, Xinxiang's board demand is expected to triple this year. This move is part of TSMC's 3DFabric Alliance to accelerate system innovation, with industry optimism for increased board demand as a result of the integration of 3D advanced packaging. Analysts anticipate a significant rise in demand for boards in the future due to the introduction of more diversified applications and leading companies adopting such technologies.
Source: YAHOO