Breakthrough: Chinese Laser Wafer Cutting Makes Significant Progress

Reported about 1 year ago

Under US sanctions, China is pushing for semiconductor industry localization, with leading laser equipment manufacturer Huagong Laser focusing on developing wafer laser cutting equipment. From launching China's first domestically produced high-end wafer laser cutting machine to providing the first laser annealing intelligent equipment for third-generation semiconductor processing, Huagong Laser has made key advancements. The equipment reduces thermal impact and edge break size, allowing for finer cutting line widths and higher semiconductor integration, making manufacturing more efficient and economical.

Source: YAHOO

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