Reported 3 days ago
Broadcom Inc. has launched its next-generation AI chips, Sian3 and Sian2M, designed to improve power efficiency and connectivity for AI workloads. These products, part of Broadcom's 200G/lane DSP PHY portfolio, enhance optical transceiver performance and reduce energy consumption by over 20%. Despite increasing competition from Chinese AI firms improving their technology, Broadcom remains a leader in the semiconductor industry, focusing on scalable, low-power optical solutions to meet the growing demands of AI applications.
Source: YAHOO