Reported 5 months ago
Samsung Electronics' latest high bandwidth memory (HBM) chips, specifically the HBM3 and HBM3E chips, are reportedly failing Nvidia's tests for use in AI processors due to issues related to heat and power consumption, according to sources. Samsung is working on optimizing its products in collaboration with customers but has faced challenges in meeting Nvidia's requirements. This development has raised concerns in the industry about Samsung falling behind competitors SK Hynix and Micron Technology in the HBM market.
Source: YAHOO