Reported 7 months ago
German optical technology leader Zeiss announced on June 12, 2024, that its first Taiwan innovation center built in Hsinchu Science Park with an investment exceeding 300 million yuan will be officially completed on the 18th. The center's first phase will introduce cutting-edge semiconductor inspection and analysis solutions for electronics, optics, and 3D X-ray microscopes, combining artificial intelligence (AI) and exclusive related technologies to enhance testing quality, improve production efficiency, and yield. The center will focus on advanced semiconductor solutions and aims to significantly improve microscope operational processes, providing more precise material and defect analysis for the semiconductor industry, thereby promoting substantial transformation momentum.
Source: YAHOO