Reported 8 months ago
On June 17th, 2024, Infineon announced the initiation of an Advanced Automotive and Wireless Communication Semiconductor Research Partner Development Program in Taiwan. They plan to upgrade the existing wireless communication R&D lab and establish the Infineon Advanced Automotive and Wireless Communication Semiconductor R&D Center in Taiwan. Infineon will collaborate with local industry-academic partners to jointly develop automotive-grade communication chips and innovative application solutions. With an investment of up to NT$1.2 billion, supported by Taiwan's Ministry of Economic Affairs A+ Project, the project aims to increase Taiwan's automotive electronics industry output to NT$60 billion. The project includes developing a new generation of automotive Bluetooth chip products in Taiwan, involving international automotive electronics R&D experts, nurturing local talent, and completing the design, production, and testing processes of new Bluetooth chips in Taiwan. Infineon will also collaborate with research institutions and local companies to develop wireless communication technology applications in automotive contexts, such as wireless battery management systems, next-gen smart cockpits, and smart car access systems.
Source: YAHOO