Reported 8 months ago
During the IEEE VLSI Symposium, following the showcase at Computex 2024 of the sixth-generation Xeon processors built on Intel 3 process with 'Sierra Forest' and full E Core energy-efficient core design, Intel presented the specifics of the Intel 3 process. Intel 3 will be the final process node to use FinFET technology, with a 10% higher transistor density and 18% improved power efficiency compared to Intel 4. Intel 3 will have four versions: standard Intel 3, silicon interconnect design Intel 3-T, expanded design Intel 3-E, and performance-enhanced Intel 3-PT.
Source: YAHOO