The new head of Samsung's chip division is feeling a significant burden of responsibility amidst various challenges - letter

Reported 4 months ago

Samsung Electronics' new head of its chip division, Young Hyun Jun, has expressed commitment to overcoming challenges in the AI era and regaining the company's position as a top semiconductor company. The South Korean tech giant has faced setbacks in high bandwidth memory (HBM) chips for AI processors, trailing behind competitors SK Hynix and Micron Technology. Despite this, Jun emphasized the potential for growth in the AI era and called for collaboration among staff to address these challenges. The company's semiconductor division has faced losses, and its HBM chips have not passed Nvidia's tests, impacting its stock performance. Jun's message also addressed issues in Samsung's foundry and system LSI businesses, as well as a potential walkout by the Samsung union demanding pay transparency and more annual leave.

Source: YAHOO

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