Reported about 7 hours ago
Nvidia's CEO Jensen Huang confirmed that despite strong demand for advanced packaging from TSMC, the company's needs are evolving, particularly as it transitions to using CoWoS-L technology for its upcoming Blackwell AI chips. The shift comes as Nvidia continues to manufacture its Hopper architecture while indicating an increase in packaging capacity, despite potential revenue impacts on TSMC from reduced CoWoS-S orders.
Source: YAHOO