Reported 8 months ago
Richtek Holdings is optimistic about the demand for advanced packaging and actively expanding production. On June 21, 2024, their subsidiary, Richtek Semiconductor, announced the construction of the K28 factory in partnership with Honcho Construction. This expansion aims to meet the growing demand for advanced packaging processes, AI chip high-energy computation, and cooling needs. Market analysts view advanced AI chip packaging capacity as vital for Richtek's future operations, as the semiconductor industry is expected to lead industry recovery. The joint construction project will involve land contributions from Richtek Semiconductor and funding from Honcho Construction, aiming for completion by the fourth quarter of 2026 to support Richtek's operational growth plan in Kaohsiung. In addition to CoWoS packaging, Richtek's expertise in 2.5D and 3D packaging technologies positions them well for strong growth in the coming years.
Source: YAHOO