Reported 8 months ago
According to FTNN News, Advanced Semiconductor Engineering (ASE) is set to hold a shareholder meeting on June 26, with market analysts anticipating improved performance in the second half of the year. Factors contributing to this optimism include the semiconductor industry's recovery, increased consumer demand for electronic products, and ASE's reinforced advanced packaging layout driven by AI. Recent expansions in packaging capabilities for AI chips and construction plans for a new facility in Kaohsiung further signify ASE's strategic focus on advanced packaging. Analysts project a steady increase in ASE's advanced packaging business from the second quarter onwards, maintaining stable ASP and gross margins. Anticipated revenue and profit growth in the second quarter and a stronger performance in the third quarter are expected to fuel market demand for ASE in the latter half of the year.
Source: YAHOO