Reported 12 months ago
In light of AI/HPC driving demand for advanced processes and memory investment, global wafer fab front-end equipment expenditures continue to grow, with Samsung, Micron, and SK Hynix investing in HBM capacity, benefiting companies like Jing Ding (3413) with strong orders and Sheng Hui* (5536) expecting significant growth in 2025 with potential M&A benefits. Jing Ding's revenue for June is anticipated to remain high, with Q2 likely setting a new record and challenging double-digit growth in Q3, leading to overall operational growth. Analysts project Jing Ding's EPS to exceed NT$20 this year with ongoing profit growth in 2025. Sheng Hui*, a leading cleanroom and electromechanical integration company, is witnessing substantial order growth, outperforming expectations, with positive outlook in the long term from improved regional demand due to supply chain diversification. Sheng Hui* is also exploring merger benefits with subsidiaries like Peng Yi* (6613), Rui Ze (7703), Sheng Yang Semiconductor (8028), Wei Si Te (6894), and Yang Bo (2493). The system integration business of Sheng Hui* is not confined to semiconductor plants, with Q1 ending in NT$33 billion orders and anticipating server client orders in Q3, positioning 50-60% of annual semiconductor revenue towards high-margin materials, gas sales, and achieving 80% order retention.
Source: YAHOO