Reported 11 months ago
SK Hynix, Micron, and Samsung Electronics have entered the market battle for the fourth generation High Bandwidth Memory (HBM4) with SK Group's chairman, Choi Tae-won, visiting TSMC to confirm a collaboration for AI chips without disclosing details. NVIDIA's upcoming Rubin AI accelerator is set to use HBM4, requiring advanced packaging assistance from TSMC, giving the company a crucial role in HBM4 applications. SK Group and TSMC have signed a memorandum to jointly develop HBM4, aiming for mass production by 2026. Micron is also focusing on high bandwidth memory advancements, with plans to capture a significant market share and release HBM4 following HBM3E. The intense competition for HBM products among the three major manufacturers is driven by the growing demand for AI accelerators using HBM as core memory.
Source: YAHOO