Reported 5 months ago
According to recent reports, SK Hynix is in negotiations with global packaging giant Amkor to collaborate on silicon interposer technology. SK Hynix aims to supply high bandwidth memory (HBM) and silicon interposers for 2.5D packaging, while Amkor will handle customer logic chip integration alongside HBM. Currently, this partnership is in the early negotiation stages. The silicon interposer is crucial in advanced packaging technologies and is essential for producing AI accelerators like the NVIDIA H100. With only a few companies capable of manufacturing silicon interposers, achieving mass production would enhance SK Hynix's delivery capabilities to clients like NVIDIA.
Source: YAHOO