Reported 8 months ago
Amid the AI boom driving advanced packaging demand, Taiwan Semiconductor Manufacturing Co. (TSMC) enters the panel-level fan-out packaging market against Intel and Samsung, with plans for higher production efficiency than current advanced packaging technologies. TSMC is collaborating with equipment and material suppliers to develop new advanced chip packaging technology, aiming to increase chip placement on a rectangular panel substrate, potentially replacing traditional circular wafers. The move signifies a significant technological shift for TSMC, with Intel and Samsung also focusing on new-generation advanced packaging technologies to meet future AI demands, highlighting the potential for industry development.
Source: YAHOO