Reported 8 months ago
Following AMD's MI 300, NVIDIA's B200 is the first to adopt Chiplet technology, which has become a significant solution to continue Moore's Law, with TSMC, Intel, Samsung, and ASE Group all actively involved. The use of Chiplet technology enhances product cost-effectiveness, marking it as a crucial turning point for the next-generation semiconductor industry. The industry is trending towards bigger sizes, with Chiplet technology enabling multiple small chips with different functions to form a system-in-package (SiP) integrated on a single substrate, fostering high-speed chip connections and technical alliances like the UCIe Consortium. Future Chiplet design trends are predicted to separate signal and high-speed transmission components to optimize computational power and reduce design costs. However, advanced packaging costs remain high, with 2.5D packaging fees around 20 times higher than conventional BGA testing costs, and escalating to at least 45 times with 3D packaging. The control of such technology is expected to be restricted to a handful of players. Taiwan's IC design industry can sustain the expenses related to this advanced process, estimated to be fewer than 10 companies.
Source: YAHOO