Reported 12 months ago
TSMC's advanced packaging division, SoIC, under the 3D Fabric platform, secures its first order from Apple for M-series chips and next-gen AI server chips, to be produced with 2nm process and expected to ramp up in 2025. By integrating advanced packaging with advanced processes, TSMC is expected to have a continuous stream of orders, boosting operations. With Apple's adoption of TSMC's SoIC, the partnership is expected to strengthen, expanding beyond InFo family to M-series designs. The move aims to enhance chip performance for applications like cloud computing, big data analytics, AI, and more. TSMC also anticipates a significant increase in SoIC capacity as Apple may adopt 2nm process and SoIC-X technology next year for new AI server chips.
Source: YAHOO