Reported 8 months ago
According to reports, TSMC is working on a new technology for advanced chip packaging using rectangular substrates instead of traditional circular ones, but commercialization is still a few years away. The move comes as the semiconductor industry sees a surge in demand for computing power driven by artificial intelligence. If successful, this shift to rectangular substrates will mark a significant technological advancement for TSMC, requiring substantial time, effort, and investment. The advanced packaging technology could potentially allow for more chips to be placed on each wafer, catering to the increasing demand for AI chips from clients like Nvidia, AMD, Amazon, and Google.
Source: YAHOO