Reported 12 months ago
As the era of Emmi approaches in 2024, Backside Power Delivery Network (BSPDN) emerges as the best solution for advanced processes, with TSMC, Intel, and imec offering different approaches focusing on wafer thinning, atomic layer deposition (ALD) testing, and reclaimed wafers. The BSPDN is considered the most advanced technology by semiconductor companies, set to be implemented by 2026. Different solutions include imec's Buried Power Rail, Intel's PowerVia, and TSMC's Super Power Rail. This technology advancement has led to adjustments in chip prices and a shift towards backside power supply in the semiconductor industry, with TSMC leading the way and attracting international collaborations to grow together.
Source: YAHOO