Reported 8 months ago
TSMC is set to increase prices for its 3nm fabrication process by over 5% and estimates a 10%-20% rise in advanced packaging pricing next year. With the demand exceeding supply for 3nm processes, TSMC's major clients like Apple and NVIDIA have orders filled until 2026. As CoWoS technology becomes more crucial due to AI accelerator demands, TSMC is expanding its capabilities to meet market needs, with projections of a significant price hike for advanced packaging services in the near future.
Source: YAHOO