Reported 2 days ago
The U.S. Commerce Department has finalized an award of up to $458 million in grants to SK Hynix to support an advanced chip packaging plant and AI research facility in Indiana. This investment is part of a larger $3.87 billion project to enhance the U.S. semiconductor supply chain, create 1,000 jobs, and mass-produce next-generation high bandwidth memory chips used in AI graphic processing units. The initiative also includes $500 million in government loans and is part of a broader $39 billion subsidy program for U.S. semiconductor manufacturing.
Source: YAHOO