US Grants SK Hynix Up to $450 Million for AI Chip Packaging Facility

Reported 2 months ago

The US Commerce Department plans to grant SK Hynix up to $450 million to support the establishment of an advanced packaging and R&D facility for AI products in Indiana, which is expected to create 1,000 jobs and enhance the US semiconductor supply chain. This comes as SK Hynix aims to invest around $3.87 billion in the project, which is part of the US government's broader initiative to boost semiconductor manufacturing.

Source: YAHOO

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