Reported about 1 year ago
The Biden administration is initiating a $1.6 billion funding competition for chip packaging research and development projects in an effort to boost the domestic semiconductor industry. The funding, derived from the 2022 Chips and Science Act, will support research in five key areas, including prototype development. This initiative aims to address the US's minimal 3% share in global chip packaging capacity, predominantly carried out in Asia. Furthermore, various companies like Intel Corp., SK Hynix Inc., Amkor Technology Inc., and Samsung Electronics Co. are establishing packaging plants in the US to enhance domestic capabilities.
Source: YAHOO