Reported 9 months ago
In order to meet the demand for AI chips, TSMC continues to expand its CoWoS advanced packaging capacity. Chunghao (5443) has joined forces with other companies to form the G2C＋ industry alliance, breaking into the CoWoS equipment supply chain to capture a share of TSMC’s market. Chunghao, along with ZHISHENG and KUENHA, formed the G2C＋ industry alliance to provide one-stop services for semiconductor equipment and factory automation. With a focus on advancing packaging equipment and a strategic investment in Sun Moon Lake Semiconductor, Chunghao is expanding into the silicon wafer sector. Investments in next-generation display technologies like Micro LED will contribute to revenue growth, and with customers expanding capital expenditures, profits are expected to continue next year. Some customers are moving production back to Taiwan due to US-China tensions, resulting in the shipment of related equipment this year.
Source: YAHOO