Reported 11 months ago
At the shareholder meeting of IC design company Chipbond (6462) held on June 25, 2024, Chairman Luo Senzhou announced the group's focus on silicon intellectual property with subsidiaries XinDing (6695) and AnGuo (8054) expected to achieve breakeven or turn profitable this year. Following AnGuo's merger with StarPlus Semiconductor, Chipbond has also acquired IP companies like Dryad and the well-established Japanese Curious, aiming to leverage their accumulated silicon IP technology. Chipbond is incorporating Die-to-Die (D2D) PHY IP into AI server chips using TSMC's 5-nanometer process and CoWoS packaging, with silicon verification in progress for 3-nanometer. Luo Senzhou highlighted the trend of chiplet stacked packaging for competitive AI chips and mentioned the company's transition towards a pure IP model next year, considering possible division of fingerprint recognition-related businesses. Chipbond plans to introduce products from its 5 to 6 unlisted subsidiaries in the second half of this year along with potential IPOs in the future, while focusing on high-speed interface IPs like DDR and PCIe, anticipating a continued effort in this strategic direction.
Source: YAHOO