Reported 11 months ago
The recent surge in interest in Fan-Out Panel Level Packaging (FOPLP) has led to discussions about changing substrate materials, with concerns about substrate warping as integrated circuits (IC) become larger. Industry insiders note that while glass can overcome warping and has better electrical properties, it also has drawbacks such as fragility and difficulty in processing. Intel is at the forefront of using glass substrates, with AMD and Samsung also looking to adopt the technology. Glass substrates offer better chemical and physical properties compared to current substrates and can increase interconnect density by 10 times. Intel has stated that glass substrates can increase chip area in a single package by 50%, allowing for more Chiplets. The OPE can be reduced by 50%, improving lithographic focus depth. Samsung has announced plans to enter the semiconductor glass substrate market by 2025, with AMD evaluating glass substrate samples to potentially enhance their HPC products' competitiveness.
Source: YAHOO