Rising Semiconductor Advanced Packaging Demand: UMC and Unimicron Collaborate to Build K28 Facility

Reported 8 months ago

UMC announced collaboration with Unimicron to construct the K28 facility through building partnerships, expecting completion in the fourth quarter of 2026. With the growing need for advanced packaging in the semiconductor industry, UMC subsidiary, Unimicron, aims to expand production to cater to AI chip high-energy computation and heat dissipation requirements. The facility, once completed, will enhance production capacity to meet the increasing demand for AI chips, reflecting positive market prospects for UMC.

Source: YAHOO

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