Reported about 11 hours ago
Taiwan Semiconductor Manufacturing Company (TSMC) has announced a groundbreaking $100 billion investment to expand its advanced chip packaging facilities in Arizona, highlighting the crucial role of packaging technology in the race for AI supremacy between the US and China. Advanced packaging allows multiple chips to be integrated closely, ensuring efficient performance for AI applications while reducing supply chain risks. As demand for these technologies surges due to the AI boom, both TSMC and US tech firms stand to benefit from a complete supply chain that enhances competitiveness in AI chip production.
Source: YAHOO