Reported 8 months ago
In a move to enhance collaboration in the field of Artificial Intelligence (AI), UMC Group, together with Arm and Intel, is rising as a formidable force in the TSMC alliance. Intel's partnership with UMC is expected to accelerate the adoption of TSMC's design services, coinciding with the restart of mature process wafer fabs, signaling an impending market recovery in the second half of the year. With UMC Group forming a tripartite alliance, TSMC becomes a key supplier of ASICs and critical IPs, earning projects in custom AI chips and venturing into the automotive market with promising prospects. Their participation in the International Design Automation Conference showcases next-gen ASIC solutions, along with insights into collaborations with Arm in automotive ASIC development and HPC SoC fields. UMC reveals successes in advanced 3D IC packaging integration, securing AI custom chip projects, positioning themselves for growth. As chip design enters a decisive era relying on EDA tools, key players like Synopsys, Cadence, and Siemens dominate the market share, yet recent trends involve close cooperation between chip designers and foundries where Taiwanese firms like TSMC, M31, and Andes Technology have made significant contributions. UMC's demonstration of Design Implementation Service (DIS) and tailored 3D IC packaging integration services at the event highlights their strong design capabilities, earning recognition from Samsung's foundries. They showcase collaborative achievements with Arm, marking their foray into the automotive sector with the latest Cortex-A720AE IP to develop AI-supported vehicle ASICs, while also entering advanced processes developing a 64-core custom SoC using Arm Neoverse Compute Subsystem (CSS) running on Intel 18A technology.
Source: YAHOO