Reported 8 months ago
Taiwan Semiconductor Manufacturing Company's (TSMC) advanced packaging process factory (P1) in the Jia Yi Science Park was halted due to the discovery of historical relics during construction. TSMC immediately initiated the preparation for the second factory (P2). The incident affected the original production plan, bringing attention to the impact on advanced packaging production capacity planning. Authorities have approved the rescue excavation of the site according to cultural heritage laws. The Jia Yi Science Park is crucial in TSMC's strategy, with plans to introduce new 3D packaging technologies and cater to the evolving AI chip market. TSMC's advanced packaging capacity is expected to increase, with the Jia Chi factory's completion by 2026 being closely watched.
Source: YAHOO