Reported 7 months ago
TSMC is reportedly purchasing equipment for the new CoWoS plant in the Chiayi campus to accelerate advanced packaging capacity construction in response to the high demand for AI chips from companies like NVIDIA and AMD. The company is also considering sending personnel to investigate additional land for future facilities in the area. TSMC aims to meet customer demands by expanding its CoWoS advanced packaging capabilities, with plans to build two new plants at the Chiayi campus to address the growing market needs for advanced packaging solutions.
Source: YAHOO